Semiconductor device

ABSTRACT

According to the present invention, a semiconductor device is provided wherein a stepdown-type DC-DC converter includes a first off detection circuit, a second off detection circuit, a capacitor, a capacitor, a diode, inverters, an inductor, a first level shift circuit, a second level shift circuit, a third level shift circuit, a 2-input NAND circuit, a 2-input NAND circuit, a high-side N-channel power MOS transistor and a low-side N-channel power MOS transistor. The first off detection circuit and the second off detection circuit reduce fall times of the gates of the N-channel power MOS transistors, thereby reducing dead time.

CROSS REFERENCE TO RELATED APPLICATIONS

The present continuation application claims benefit of priority under 35U.S.C. §120 to application Ser. No. 11/531,612, filed on Sep. 13, 2006,and under 35 U.S.C. §119 from Japanese Patent Application No.2005-285625, filed on Sep. 29, 2005, the entire contents of both arehereby incorporated herein by reference.

BACKGROUND OF THE INVENTION

DC-DC converters, inverters or regulators and the like are provided withhigh-side switching elements and low-side switching elements at outputsections thereof. In addition, mask time setting circuits for setting adead time during which the pair of switching elements are simultaneouslyswitched off are provided in order to prevent both switching elementsfrom being simultaneously switched on, whereby breakthrough currents aregenerated.

In the DC-DC converter described in US Patent Application Publication2004/0207372 or the like, in consideration of variations in elements, itis necessary to set a long delay time of the mask time setting circuitto make sure that the high-side and low-side switching elements are notsimultaneously switched on. Therefore, a problem may exist where thedead time is lengthened, thereby preventing improvement of conversionefficiency of the DC-DC converter.

SUMMARY OF THE INVENTION

A semiconductor device according to an aspect of the present inventionincludes: a high-side switching element provided on a high-potentialside power source side and switched on/off by a signal inputted to acontrol electrode; a low-side switching element provided on alow-potential side power source side and switched on/off by a signalinputted to a control electrode; a first off detection circuit having afirst constant current source which generates a constant current, afirst transistor in which a first electrode is connected to the controlelectrode of the low-side switching element and a second electrode isconnected to the first constant current source where the firsttransistor is switched on by a first voltage applied to the controlelectrode, and a first signal level detection section which detects asignal level of the control electrode of the low-side switching element,where the first constant current source and the first transistordischarge charges accumulated in the first signal level detectionsection when the low-side switching element switches from the on stateto the off state.

A semiconductor device according to another aspect of the presentinvention includes: a high-side switching element provided on ahigh-potential side power source side and switched on/off by a signalinputted to a control electrode; a low-side switching element providedon a low-potential side power source side and switched on/off by asignal inputted to a control electrode; a second off detection circuithaving a second constant current source which generates a constantcurrent, a second transistor in which a first electrode is connected tothe control electrode of the high-side switching element and a secondelectrode is connected to the second constant current source where thesecond transistor is switched on by a second voltage applied to thecontrol electrode, and a second signal level detection section whichdetects a signal level of the control electrode of the high-sideswitching element, where the second constant current source and thesecond transistor discharge charges accumulated in the second signallevel detection section when the high-side switching element switchesfrom the on state to the off state.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a circuit diagram showing a stepdown-type DC-DC converter as asemiconductor device according to a first embodiment of the presentinvention;

FIG. 2 is a circuit diagram showing a first off detection circuitaccording to the first embodiment;

FIG. 3 is a circuit diagram showing a second off detection circuitaccording to the first embodiment;

FIG. 4 is a timing chart showing an operation of the stepdown-type DC-DCaccording to the first embodiment;

FIG. 5 is a circuit diagram showing a first off detection circuitaccording to a second embodiment;

FIG. 6 is a circuit diagram showing a second off detection circuitaccording to the second embodiment;

FIG. 7 is a circuit diagram showing a stepdown-type DC-DC converter as asemiconductor device according to a third embodiment;

FIG. 8 is a circuit diagram showing a stepdown-type DC-DC converter as asemiconductor device according to a fourth embodiment; and

FIG. 9 is a timing chart showing an operation of the stepdown-type DC-DCaccording to the fourth embodiment.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention will now be described withreference to the drawings.

First Embodiment

First, a semiconductor device according to a first embodiment of thepresent invention will be described with reference to the drawings. FIG.1 is a circuit diagram of a stepdown-type DC-DC converter as asemiconductor device, FIG. 2 is a circuit diagram showing a first offdetection circuit, and FIG. 3 is a circuit diagram showing a second offdetection circuit. In the present embodiment, N-channel power MOS (MetalOxide Semiconductor) transistors with low on-resistances and highdriving capabilities are respectively used as the high-side switchingelement and the low-side switching element of an output section.

As shown in FIG. 1, the stepdown-type DC-DC converter 1 is provided witha first off detection circuit 2 a, a second off detection circuit 2 b, acapacitor C1, a capacitor C2, a diode D1, inverters INV1 to INV4, aninverter INV6, an inverter INV7, an inductor L1, a first level shiftcircuit LS1, a second level shift circuit LS2, a third level shiftcircuit LS3, a 2-input NAND circuit NAND1, a 2-input NAND circuit NAND2,an N-channel power MOS transistor NT1 and an N-channel power MOStransistor NT2.

At the stepdown-type DC-DC converter, an input power (input voltage) Vinof, for instance, 19 V, that is higher than a control circuit power Vddis inputted, while the N-channel power MOS transistor NT1 which is ahigh-side switching element and the N-channel power MOS transistor NT2which is a low-side switching element are operated based on on/offcontrol signals, and a high output current of, for instance, 1.5 V, thatis lower than the control circuit power Vdd is outputted. MOStransistors are also referred to as MOSFETs (Metal Oxide SemiconductorField Effect Transistors).

When improving conversion efficiencies of stepdown-type DC-DC convertersand the like, it is necessary to reduce steady loss (which may beapproximately represented as: on-resistance of power MOS transistormultiplied by output current) during the on states of both the high-sideN-channel power MOS transistor NT1 and the low-side N-channel power MOStransistor NT2. In particular, reducing the on-resistance of power MOStransistors is effective.

The inverter INV1 receives as input an on/off control signal which is asignal for controlling on/off operations of the N-channel power MOStransistor NT1 which is a high-side switching element and the N-channelpower MOS transistor NT2 which is a low-side switching element, andinverts their signal levels.

The 2-input NAND circuit NAND1, provided between inverters INV1 andINV6, and the inverter INV2, to which signals of node N1 outputted fromthe inverter INV1 and signals of node N15 outputted from the inverterINV6 are inputted, and outputs signals which are results of logicaloperations.

The inverter INV2, provided between the 2-input NAND circuit NAND1, andthe gate of the N-channel power MOS transistor NT2 and the first offdetection circuit 2 a, receives as input signals of node N2 outputtedfrom the 2-input NAND circuit NAND1 and inverts their signal levels.

The first level shift circuit LS1 is provided between the inverter INV1and the inverter INV3, and raises the signal level of node N1, which isbased on the low-potential side power source Vss, outputted from theinverter INV1 to a signal level based on a node Lx between the N-channelpower MOS transistor NT1 and the N-channel power MOS transistor NT2.

The inverter INV3, provided between the first level shift circuit LS1and the 2-input NAND circuit NAND2, receives as input signals of node N4outputted from the first level shift circuit LS1, and inverts theirsignal levels.

The 2-input NAND circuit NAND2, provided between the inverter INV3 andthe second level shift circuit LS2, and the inverter INV4, receives asinput signals of node N5 outputted from the inverter INV3 and signals ofnode N12 outputted from the second level shift circuit LS2, and outputssignals which are results of logical operations.

The inverter INV4, provided between the 2-input NAND circuit NAND2, andthe gate of the N-channel power MOS transistor NT1 and the second offdetection circuit 2 b, receives as input signals of node N6 outputtedfrom the 2-input NAND circuit NAND2, and inverts their signal levels.

The first off detection circuit 2 a, positioned between the controlcircuit power source Vdd and the low-potential side power source Vss, isprovided between the inverter INV2 and the gate of the N-channel powerMOS transistor NT2, and the inverter INV7, and detects signal levels ofthe gate of the N-channel power MOS transistor NT2.

The inverter INV7, provided between the first off detection circuit 2 aand the second level shift circuit LS2, receives as input signals ofnode N11 outputted from the first off detection circuit 2 a, and invertstheir signal levels.

The second level shift circuit LS2 is provided between the inverter 7and the 2-input NAND circuit NAND2, and raises the signal level of nodeN16, which is based on the low-potential side power source Vss andoutputted from the inverter 7, to a signal level based on a node Lxbetween the N-channel power MOS transistor NT1 and the N-channel powerMOS transistor NT2.

The second off detection circuit 2 b, positioned between a BST terminal3 and the node Lx, is provided between the inverter 4 and the gate ofthe N-channel power MOS transistor NT1, and the third level shiftcircuit LS3, and detects signal levels of the gate of the N-channelpower MOS transistor NT1.

The third level shift circuit LS3, provided between the second offdetection circuit 2 b and the inverter 6, inputs signals of the node 13,which is based on the Node Lx between the N-channel power MOS transistorNT1 and the N-channel power MOS transistor NT2 and is outputted by thesecond off detection circuit 2 b, and steps down the signal level to asignal level based on the low-potential side power source Vss.

The inverter INV6, provided between the third level shift circuit LS3and the 2-input NAND circuit NAND1, receives as input signals of nodeN14 outputted from the third level shift circuit LS3, and outputssignals of the node N15 which are inverted signals to the 2-input NANDcircuit NAND1.

A drain of the N-channel power MOS transistor NT1 is connected as afirst electrode to the input power source (input voltage) Vin which isthe high-potential side power source, and a source thereof is connectedto the node Lx as a second electrode. Signals of the node N7 outputtedfrom the inverter INV4 are inputted to the gate of the N-channel powerMOS transistor NT1 which is a control electrode, and on/off of theN-channel power MOS transistor NT1 is operated based on the inputtedsignals.

A drain of the N-channel power MOS transistor NT2 is connected as afirst electrode to the node Lx, and a source thereof is connected tolow-potential side power source Vss as a second electrode. Signals ofthe node N3 outputted from the inverter INV2 are inputted to the gate ofthe N-channel power MOS transistor NT2 which is a control electrode, andon/off of the N-channel power MOS transistor NT2 is operated based onthe inputted signals.

At the diode D1, a cathode thereof is connected to the BST terminal 3while an anode thereof is connected to the control circuit power sourceVdd, and when the control circuit power Vdd is supplied, the BSTterminal is raised to the voltage level of the control circuit powersource Vdd. When the N-channel power MOS transistor NT1 is switched onand the BST terminal 3 is raised to a level of Vin+Vdd, the diode D1functions as a protection diode for preventing the BST terminal 3 fromstepping down.

One end of the capacitor C1 is connected to the BST terminal 3, whilethe other end is connected to the node Lx side. One end of the inductorL1 is connected to the other end of the capacitor C1 and the nodeLx-side, while the other end is connected to one end of the capacitorC2. The other end of the capacitor C2 is connected to the lowpotential-side power source Vss. The inductor L1 and the capacitors C1and C2 enable large capacity current to be supplied to a load, notshown, under an output voltage Vout that is lower than the voltage ofthe node Lx.

As shown in FIG. 2, a constant current source 4, an N-channel MOStransistor NT 14 and a signal level detection section 11 a are providedin the first off detection circuit 2 a. The signal level detectionsection 11 a is composed of N-channel MOS transistors NT11 to NT13, aP-channel MOS transistor PT11 and an inverter INV5, and detects signallevels of the gate of the low-side N-channel power MOS transistor NT2.

At the N-channel MOS transistor NT14, a drain thereof is connected tothe gate of the N-channel power MOS transistor NT2 as a first electrode,a source thereof is connected to the node N21 as a second electrode, anda gate thereof is connected to the control circuit power source Vdd as acontrol electrode. The node N21 changes to a high level when the gate ofthe N-channel power MOS transistor NT2 is at a high level, and changesto a low level when the gate of the N-channel power MOS transistor NT2is at a low level. For the N-channel MOS transistor NT14, a transistorwith a drain-source breakdown voltage (Vds) which is greater than theMOS transistor that configures the control circuit is used so thaton/off operations may be performed even when the voltage applied to thegate of the N-channel power MOS transistor NT2 is high. By using theN-channel MOS transistor NT14 in this manner, reduction in chip size maybe achieved compared to cases where a P-channel MOS transistor is used.

The constant current source 4 is provided between the node N21 and thelow-potential-side power source Vss, and supplies a constant current tothe low-potential-side power source Vss side. Therefore, when the gateof the N-channel power MOS transistor NT2 changes from a high level to alow level, the constant current source 4 functions to promptly changethe signal level of the node N21 from high to low. In addition, when thegate of the N-channel power MOS transistor NT2 is at a high level, thedrain current (Id) of the N-channel MOS transistor NT14 is determined bythe constant current source 4.

A source of the P-channel MOS transistor PT11 is connected to thecontrol circuit power source Vdd, while a drain thereof is connected tothe drain of the N-channel MOS transistor NT11, and a gate thereof isconnected to the node N21. A source of the N-channel MOS transistor NT11is connected to the low-potential-side power source Vss, and a gatethereof is connected to the node N21. The P-channel MOS transistor PT11and the N-channel MOS transistor NT11 compose an inverter which receivesas input signals of the node N21 and outputs inverted signals to thenode N22.

The inverter INV5 receives as input signals of the node N22 and invertsthe signals before outputting them to the node N23. A drain of theN-channel MOS transistor NT12 is connected to the node N22, while asource thereof is connected to the drain of the N-channel MOS transistorNT13, and a gate thereof is connected to the node N21 side. A source ofthe N-channel MOS transistor NT13 is connected to the low-potential-sidepower source Vss, and a gate thereof is connected to the node N23.Signals of the node N23 outputted from the inverter INV5 are inputted tothe inverter INV7.

When the gate of the N-channel power MOS transistor NT2 changes from ahigh level to a low level, charges accumulated in the signal leveldetection section 1 la are promptly discharged via the constant currentsource 4 and the N-channel MOS transistor NT14 which functions as adiode during its on state.

As shown in FIG. 3, a constant current source 4, an N-channel MOStransistor NT 14 and a signal level detection section 11 b are providedin the second off detection circuit 2 b. The signal level detectionsection 11 b is composed of N-channel MOS transistors NT11 to NT13, aP-channel MOS transistor PT11 and an inverter INV5, and detects signallevels of the gate of the high-side N-channel power MOS transistor NT1.

At the N-channel MOS transistor NT14, a drain thereof is connected tothe gate of the N-channel power MOS transistor NT1 as a first electrode,a source thereof is connected to the node N21 as a second electrode, anda gate thereof is connected to the BST terminal 3 as a controlelectrode. The node N21 changes to a high level when the gate of theN-channel power MOS transistor NT1 is at a high level, and changes to alow level when the gate of the N-channel power MOS transistor NT1 is ata low level. For the N-channel MOS transistor NT14, a transistor with adrain-source breakdown voltage (Vds) which is greater than the MOStransistor that configures the control circuit is used so that on/offoperations may be performed even when the voltage applied to the gate ofthe N-channel power MOS transistor NT1 is high.

The constant current source 4 is provided between the node N21 and thenode Lx, and supplies a constant current to the node Lx side. Therefore,when the gate of the N-channel power MOS transistor NT1 changes from ahigh level to a low level, the constant current source 4 functions topromptly change the signal level of the node N21 from high to low. Inaddition, when the gate of the N-channel power MOS transistor NT1 is ata high level, the drain current (Id) of the N-channel MOS transistorNT14 is determined by the constant current source 4.

A source of the P-channel MOS transistor PT11 is connected to the BSTterminal 3, while a drain thereof is connected to the drain of theN-channel MOS transistor NT11, and a gate thereof is connected to thenode N21. A source of the N-channel MOS transistor NT11 is connected tothe node Lx, and a gate thereof is connected to the node N21. TheP-channel MOS transistor PT11 and the N-channel MOS transistor NT11compose an inverter which inputs signals of the node N21 and outputsinverted signals to the node N22.

The inverter INV5 inputs signals of the node N22 and inverts the signalsbefore outputting them to the node N23. A drain of the N-channel MOStransistor NT12 is connected to the node N22, while a source thereof isconnected to the drain of the N-channel MOS transistor NT13, and a gatethereof is connected to the node N21 side. A source of the N-channel MOStransistor NT13 is connected to the node Lx, and a gate thereof isconnected to the node N23. Signals of the node N23 outputted from theinverter INV5 are inputted to the third level shift detection circuitLS3.

When the gate of the N-channel power MOS transistor NT1 changes from ahigh level to a low level, charges accumulated in the signal leveldetection section 11 b are promptly discharged via the constant currentsource 4 and the N-channel MOS transistor NT14 which functions as adiode during its on state. The signal level of signals outputted fromthe inverter INV5 of the second off detection circuit 2 b are higherthan the signal level of signals outputted from the inverter INV5 of thefirst off detection circuit 2 a.

Next, operations of the stepdown-type DC-DC converter will be describedwith reference to FIG. 4. FIG. 4 is a timing chart showing an operationof the stepdown-type DC-DC converter. In this case, the potential of thelow-potential side power source Vss is set to 0 V of ground level, thelow level of the on/off control signal is set to 0 V of ground level,and the high level is set to the voltage of the control circuit powersource Vdd.

As shown in FIG. 4, at the stepdown-type DC-DC converter 1, the voltagelevel of the BST terminal 3 changes to a control circuit power sourceVdd voltage level (Vdd level) when input power (input voltage) andcontrol circuit power Vdd are supplied.

When the on/off control signal is at a low level, the level of the nodeN1 changes to high and the level of the node N5 changes to low. Sincethe node N5 is at a low level, the level of the node N6 which is anoutput of the 2-input NAND circuit NAND 2 changes to high and the levelof the node N7 changes to low (Vss 0 V level), and the high-sideN-channel power MOS transistor NT1 changes to off.

Since the N-channel power MOS transistor NT1 changes to off, the levelof the node N13 changes to low, the level of the node N14 changes to lowand the level of the node N15 changes to high. Since the node N1 is at ahigh level and the node 15 is at a high level, the level of the node N2which is an output of the 2-input NAND circuit NAND1 changes to low andthe level of the node N3 changes to high (Vdd level), and the low-sideN-channel power MOS transistor NT2 changes to on.

Since the N-channel power MOS transistor NT1 is changed to on, the levelof the node N11 changes to high, the level of the node N16 changes tolow and the level of the node N12 changes to low. Therefore, the signalsof the node N6 outputted from the 2-input NAND circuit NAND2 maintains ahigh level.

Next, when the on/off control signal changes from a low level to a highlevel, since the node N1 is at a low level, the level of the node N2which is an output of the 2-input NAND circuit NAND1 changes to high andthe level of the node N3 changes to low (Vss 0 V level), and thelow-side N-channel power MOS transistor NT2 changes to off.

At this point, since charges accumulated in the signal level detectionsection 11 a of the first off detection circuit 2 a are promptlydischarged via the constant current source 4 and the N-channel MOStransistor NT14 which functions as a diode during its on state, thelow-side N-channel power MOS transistor NT2 falls rapidly, therebyreducing the fall time toff (NT2) of the gate of the N-channel power MOStransistor NT2. In addition, the time required for detection of a changefrom an on state to an off state of the N-channel power MOS transistorNT2 by the first off detection circuit 2 a may be reduced.

Moreover, even when the voltage to be applied to the gate of theN-channel power MOS transistor NT2 becomes high, since the N-channel MOStransistor N14 with a large drain-source breakdown voltage (Vds) inwhich on/off operations may be performed is provided in the first offdetection circuit 2 a, the voltage applied to the gate of the N-channelpower MOS transistor NT2 may be increased and the on-resistance of theN-channel power MOS transistor NT2 may be reduced.

Although the Vdd level has been used in this case as the high level ofthe gate of the N-channel power MOS transistor NT2, for instance, alevel shift circuit may be provided between the inverter INV2 and thegate of the N-channel power MOS transistor NT2, and the high level ofthe gate of the N-channel power MOS transistor NT2 may be set to a levelthat is higher than the Vdd level in order to further reduce theon-resistance.

When the N-channel power MOS transistor NT1 changes to off, the level ofthe node Nil changes to low, the level of the node N16 changes to high,and the level of the node N12 changes to high. Since the node N12 is ata high level and the node N5 is at a high level, the level of the nodeN6 which is an output of the 2-input NAND circuit NAND2 changes to lowand the level of the node N7 changes to high (Vin+Vdd level), and thehigh-side N-channel power MOS transistor NT1 changes to on.

At this point, since the low-side N-channel power MOS transistor NT2 hasalready been switched off, a dead time Td1 between the rise time ton(NT1) of the gate of the high-side N-channel power MOS transistor NT1and the fall time toff (NT2) of the gate of the low-side N-channel powerMOS transistor NT2 may be reduced.

When the N-channel power MOS transistor NT1 changes to on, the level ofthe node Lx changes to high (Vin level), and the voltage of the BSTterminal 3 is raised to Vin+Vdd.

Next, when the on/off control signal changes from a high level to a lowlevel, the node N1 changes to a high level, and the level of the node N5changes to a low level. Since the node N5 is at a low level, the levelof the node N6 which is an output of the 2-input NAND circuit NAND2changes to high and the level of the node N7 changes to low (Vss 0 Vlevel), and the high-side N-channel power MOS transistor NT1 changes tooff.

At this point, since charges accumulated in the signal level detectionsection 11 b of the second off detection circuit 2 b are promptlydischarged via the constant current source 4 and the N-channel MOStransistor NT14 which functions as a diode during its on state, thehigh-side N-channel power MOS transistor NT1 falls rapidly, therebyreducing the fall time toff (NT1) of the gate of the N-channel power MOStransistor NT1. In addition, the time required for detection of a changefrom an on state to an off state of the N-channel power MOS transistorNT1 by the second off detection circuit 2 b may be reduced.

Moreover, even when the voltage to be applied to the gate of theN-channel power MOS transistor NT1 changes to high, since the N-channelMOS transistor N14 with a large drain-source breakdown voltage (Vds) inwhich on/off operations may be performed is provided in the second offdetection circuit 2 b, the voltage applied to the gate of the N-channelpower MOS transistor NT1 may be increased and the on-resistance of theN-channel power MOS transistor NT1 may be reduced.

When the N-channel power MOS transistor NT1 changes to off, the level ofthe node N13 changes to low, the level of the node N14 changes to lowand the level of the node N15 changes to high. Since the node N15 is ata high level and the node N1 is at a high level, the level of the nodeN2 which is an output of the 2-input NAND circuit NAND1 changes to lowand the level of the node N3 changes to high (Vdd level), and thelow-side N-channel power MOS transistor NT2 changes to on.

At this point, since the high-side N-channel power MOS transistor NT1has already been switched to off, a dead time Td2 between the rise timeton (NT2) of the gate of the low-side N-channel power MOS transistor NT2and the fall time toff (NT1) of the gate of the high-side N-channelpower MOS transistor NT 1 may be reduced.

When the N-channel power MOS transistor NT1 changes to off, the level ofthe node Lx changes to low, while the voltage of the BST terminal 3 ismaintained at Vin+Vdd.

In a stepdown-type DC-DC converter and the like, since the on-time ofthe low-side N-channel power MOS transistor NT2 is set to be greaterthan the on-time of the high-side N-channel power MOS transistor NT1,the steady loss (which may be approximately represented as:on-resistance of power MOS transistor multiplied by output current)during the on state of the low-side N-channel power MOS transistor NT2will be greater than the steady loss during the on state of thehigh-side N-channel power MOS transistor NT1.

As described above, the semiconductor device according to the presentembodiment is provided with: a first off detection circuit 2 a,positioned between the control circuit power source Vdd and thelow-potential side power source Vss, which is provided between theinverter 2 and the gate of the N-channel power MOS transistor NT2, andthe inverter 7, where the first off detection circuit 2 a is composed ofthe constant current source 4, the inverter INV5, N-channel MOStransistors NT11 to NT14 and the P-channel MOS transistor PT11, andfunctions to detect signal levels of the gate of the low-side N-channelpower MOS transistor NT2; and a second off detection circuit 2 b,positioned between the BST terminal 3 and the node Lx, which is providedbetween the inverter 4 and the gate of the N-channel power MOStransistor NT1, and the third level shift circuit LS3, where the secondoff detection circuit 2 b is composed of the constant current source 4,the inverter INV5, N-channel MOS transistors NT11 to NT14 and theP-channel MOS transistor PT11, and functions to detect signal levels ofthe gate of the high-side N-channel power MOS transistor NT1. Theconstant current source 4 functions to promptly change the potential ofthe gates of the N-channel power MOS transistors from a high level to alow level.

Therefore, when the low-side N-channel power MOS transistor NT2 changesfrom on to off, since charges accumulated in the signal level detectionsection 11 a of the first off detection circuit 2 a are promptlydischarged via the constant current source 4 and the N-channel MOStransistor NT14 of the first off detection circuit 2 a which functionsas a diode during its on state, the fall time toff (NT2) of the gate ofthe N-channel power MOS transistor NT2 may be reduced, thereby enablingthe low-side N-channel power MOS transistor NT2 to fall rapidly. On theother hand, when the high-side N-channel power MOS transistor NT1changes from on to off, since charges accumulated in the signal leveldetection section 11 b of the second off detection circuit 2 b arepromptly discharged via the constant current source 4 and the N-channelMOS transistor NT14 of the second off detection circuit 2 b whichfunctions as a diode during its on state, the fall time toff (NT1) ofthe gate of the N-channel power MOS transistor NT1 may be reduced,thereby enabling the high-side N-channel power MOS transistor NT1 tofall rapidly. In addition, since a transistor with a drain-sourcebreakdown voltage (Vds) greater than the MOS transistor that configuresthe control circuit so that on/off operations may be performed in evenwhen the voltage applied to the gate of the N-channel power MOStransistor NT1 is high is provided in the N-channel MOS transistor NT14,the voltage applied to the gates of the N-channel power MOS transistorsmay be increased, thereby enabling the on-resistance of the N-channelpower MOS transistor to be reduced.

Therefore, reduction of the dead time as well as the on-resistances ofthe N-channel power MOS transistors may be achieved, thereby enablingimprovement of the conversion efficiency of the stepdown-type DC-DCconverter.

In the present embodiment, while the first off detection circuit 2 a isused for reducing the fall time of the gate of the low-side N-channelpower MOS transistor to reduce the dead time Td1, and the second offdetection circuit 2 b is used for reducing the fall time of the gate ofthe high-side N-channel power MOS transistor to reduce the dead timeTd2, the first off detection circuit 2 a may alternatively be used toreduce only the fall time of the gate of the low-side N-channel powerMOS transistor.

In addition, while a silicon dioxide film has been used as the gateinsulator of the MOS transistor, MISFETs (metal insulator semiconductorfield effect transistors) which use SiN_(x)O_(y) films produced bythermal nitridation of silicon dioxide films, film stacks of siliconnitride film (Si₃O₄)/silicon dioxide film, or high-dielectric films(high-K gate insulation film) and the like as gate insulators, may beused instead.

Furthermore, while an N-channel MOS transistor NT14 with a largedrain-source breakdown voltage (Vds) and a large gate-drain breakdownvoltage has been used as the first off detection circuit 2 a and thesecond off detection circuit 2 b, a P-channel MOS transistor with alarge drain-source breakdown voltage (Vds) and a large gate-drainbreakdown voltage may be used instead. In this case, it is preferredthat the source of the P-channel MOS transistor as a second electrode isconnected to the gate of the N-channel power MOS transistor, the drainthereof as a first electrode is connected to the low-potential side, andan inverter is positioned at the preceding stage of the gate so that theP-channel MOS transistor is switched on when the gate is at a low level.

Second Embodiment

Next, a semiconductor device according to a second embodiment of thepresent invention will be described with reference to the drawings. FIG.5 is a circuit diagram showing a first off detection circuit, while FIG.6 shows a second off detection circuit. For the present embodiment,N-channel MOS transistors have been added to the first and second offdetection circuits of the first embodiment.

In the following description of the second, third, and fourthembodiments, like components to the first embodiment will be assignedlike reference characters, and descriptions thereof will be omitted.Thus, portions that differ from the first embodiment will be explained.

As shown in FIG. 5, a constant current source 4, an N-channel MOStransistor NT 14, an N-channel MOS transistor NT 15 and a signal leveldetection section 11 a are provided in the first off detection circuit 2c. The first off detection circuit 2 c is the first off detectioncircuit 2 a of FIG. 1 to which the N-channel MOS transistor NT 15 hasbeen added.

The drain of the N-channel MOS transistor NT 15 of the first offdetection circuit 2 c is connected to a node N21, while the sourcethereof is connected to a low-potential side power source Vss, and agate input signal INa is inputted to the gate thereof. When the low-sideN-channel power MOS transistor NT2 changes from on to off, the gateinput signal INa supplies a high level (Vdd level) signal to theN-channel MOS transistor NT 15 of the first off detection circuit 2 c toswitch on the N-channel MOS transistor NT 15.

As shown in FIG. 6, a constant current source 4, an N-channel MOStransistor NT 14, an N-channel MOS transistor NT 15 and a signal leveldetection section 11 b are provided in the second off detection circuit2 d. The second off detection circuit 2 d is the second off detectioncircuit 2 b of FIG. 3 to which the N-channel MOS transistor NT 15 hasbeen added.

The drain of the N-channel MOS transistor NT 15 of the second offdetection circuit 2 d is connected to a node N21, while the sourcethereof is connected to a node Lx, and a gate input signal INb isinputted to the gate thereof. When the high-side N-channel power MOStransistor NT1 changes from on to off, the gate input signal INbsupplies a high level (Vin+Vdd level) signal to the N-channel MOStransistor NT 15 of the second off detection circuit 2 d to switch onthe N-channel MOS transistor NT 15.

As described above, in the semiconductor device of the presentembodiment, an N-channel MOS transistor NT15 has been provided in thefirst off detection circuit 2 c, where a gate input signal INa which isa high level (Vdd level) signal is inputted to the gate of the first offdetection circuit 2 c when the low-side N-channel power MOS transistorNT2 changes from on to off. An N-channel MOS transistor NT15 has beenprovided in the second off detection circuit 2 d, where a gate inputsignal INb which is a high level (Vin+Vdd level) signal is inputted tothe gate of the second off detection circuit 2 d when the high-sideN-channel power MOS transistor NT1 changes from on to off.

Therefore, when the low-side N-channel power MOS transistor NT2 changesfrom on to off, since charges accumulated in the signal level detectionsection 11 a of the first off detection circuit 2 c are promptlydischarged via the constant current source 4, the N-channel MOStransistor NT15 of the first off detection circuit 2 c, and theN-channel MOS transistor NT14 of the first off detection circuit 2 cwhich functions as a diode in its on state, the fall time toff (NT2) ofthe gate of the N-channel power MOS transistor NT2 may be reduced ascompared to that of the first embodiment, thereby enabling the low-sideN-channel power MOS transistor NT2 to fall rapidly. On the other hand,when the high-side N-channel power MOS transistor NT1 changes from on tooff, since charges accumulated in the signal level detection section 11b of the second off detection circuit 2 d are promptly discharged viathe constant current source 4, the N-channel MOS transistor NT15, andthe N-channel MOS transistor NT14 of the second off detection circuit 2d which functions as a diode in its on state, the fall time toff (NT 1)of the gate of the N-channel power MOS transistor NT1 may be reduced ascompared to that of the first embodiment, thereby enabling the high-sideN-channel power MOS transistor NT1 to fall rapidly. In addition, since atransistor with a drain-source breakdown voltage (Vds) greater than theMOS transistor that configures the control circuit so that on/offoperations may be performed even when the voltage applied to the gate ofthe N-channel power MOS transistor NT1 is high is provided in theN-channel MOS transistor NT14, the voltage applied to the gates of theN-channel power MOS transistors may be increased, thereby enabling theon-resistances of the N-channel power MOS transistors to be reduced.

Therefore, reduction in the dead time as well as the on-resistances ofthe N-channel power MOS transistors may be achieved, thereby enablingimprovement of the conversion efficiency of the stepdown-type DC-DCconverter in comparison to the first embodiment.

Third Embodiment

Next, a semiconductor device according to a third embodiment of thepresent invention will be described with reference to the drawings. FIG.7 is a circuit diagram showing a stepdown-type DC-DC converter as asemiconductor device. In the present embodiment, a P-channel power MOStransistor is used as the high-side switching element, while anN-channel power MOS transistor is used as the low-side switchingelement.

As shown in FIG. 7, the stepdown-type DC-DC converter 1 a is providedwith a first off detection circuit 2 e, a second off detection circuit 2f, a buffer circuit Buff1, a capacitor C3, inverters INV1 to INV3, aninverter INV7, an inductor L2, a first level shift circuit LS1, a secondlevel shift circuit LS2, a third level shift circuit LS3, a 2-input NANDcircuit NAND1, a 2-input NAND circuit NAND2, an N-channel power MOStransistor NT2 a and a P-channel power MOS transistor PT1.

The first level shift circuit LS1 is provided between the inverter INV1and the inverter INV3, and raises the signal levels of the node N1outputted from the inverter INV1.

The buffer circuit Buff1 is provided between the 2-input NAND circuitNAND2, and the gate of the P-channel power MOS transistor PT1 and thesecond off detection circuit 2 f, and inputs signals of node N6outputted from the 2-input NAND circuit NAND2 and drives the signals.

The first off detection circuit 2 e, having the same circuitconfiguration as the first off detection circuit 2 a shown in FIG. 2, ispositioned between the control circuit power source Vdd and thelow-potential side power source Vss and is provided between the inverterINV2 and the gate of the N-channel power MOS transistor NT2 a, and theinverter INV7, and detects signal levels of the gate of the N-channelpower MOS transistor NT2 a.

The second level shift circuit LS2 is provided between the inverter INV7and the 2-input NAND circuit NAND2, and raises signal levels of the nodeN16 based on the low-potential side power source Vss, outputted from theinverter INV7.

The second off detection circuit 2 f, having the same circuitconfiguration as the second off detection circuit 2 b shown in FIG. 3,is positioned between the input power source (input voltage) Vin and thelow-potential side power source Vss and is provided between the buffercircuit Buff1 and the gate of the P-channel power MOS transistor PT1,and the third level shift circuit LS3, and detects signal levels of thegate of the P-channel power MOS transistor PT 1.

A source of the high-side P-channel power MOS transistor PT1 isconnected as a second electrode to the input power source (inputvoltage) Vin as a high-potential side power source, and a drain thereofis connected to the node Lx as a first electrode. Signals of the node N6outputted from the 2-input NAND circuit NAND2 which is driven by thebuffer circuit Buff1 are inputted to a gate of the high-side P-channelpower MOS transistor PT1 as a control electrode, and on/off operationsof the P-channel power MOS transistor PT1 are performed based on theinputted signals.

A drain of the low-side N-channel power MOS transistor NT2 a isconnected as a first electrode to the node Lx, and a source thereof isconnected to low-potential side power source Vss as a second electrode.Signals of the node N3 outputted from the inverter INV2 are inputted tothe gate which is a control electrode, and on/off operations of theN-channel power MOS transistor NT2 a are performed based on the inputtedsignals.

One end of the inductor L2 is connected to the node Lx, while the otherend is connected to one end of the capacitor C3. The other end of thecapacitor C3 is connected to the low potential-side power source Vss.The inductor L2 and the capacitor C3 enable large capacity current to besupplied to a load, not shown, under an output voltage Vout that islower than the voltage of the node Lx.

Next, operations of the stepdown-type DC-DC converter 1 a will bedescribed. When the on/off control signal is at a low level, the node N1changes to a high level and the node N5 changes to a low level. Sincethe node N5 is at a low level, the level of the node N6 which is anoutput of the 2-input NAND circuit NAND2 changes to high, and thehigh-side P-channel power MOS transistor PT1 changes to off.

Since the P-channel power MOS transistor PT1 changes to off, the levelof the node N13 changes to high and the level of the node N14 changes tohigh. Since the node N1 is at a high level and the node 14 is at a highlevel, the level of the node N2 which is an output of the 2-input NANDcircuit NAND1 changes to low and the level of the node N3 changes tohigh, and the low-side N-channel power MOS transistor NT2 a changes toon.

Since the N-channel power MOS transistor NT2 a is changed to on, thelevel of the node N11 changes to high, the level of the node N16 changesto low and the level of the node N12 changes to low. The signals of thenode N6 outputted from the 2-input NAND circuit NAND2 are maintained ata high level.

Next, when the on/off control signal changes from a low level to a highlevel, since the node N1 is at a low level, the level of the node N2which is an output of the 2-input NAND circuit NAND1 changes to high andthe level of the node N3 changes to low (Vss 0 V level), and thelow-side N-channel power MOS transistor NT2 changes to off.

At this point, in the same manner as in the first embodiment, sincecharges accumulated in the signal level detection section of the firstoff detection circuit 2 e are promptly discharged, the fall time of thegate of the N-channel power MOS transistor NT2 a may be reduced, therebyenabling changes of the N-channel power MOS transistor NT2 a from an onstate to an off state to be detected in less time.

When the N-channel power MOS transistor NT2 a changes to off, the nodeN11 changes to a low level, the node N16 changes to a high level, andthe node N12 changes to a high level. Since the node N12 is at a highlevel and the node N5 is at a high level, the level of the node N6 whichis an output of the 2-input NAND circuit NAND2 changes to low, and thehigh-side P-channel power MOS transistor PT1 changes to on.

When the P-channel power MOS transistor PT1 changes to on, the node Lxchanges to a high level (Vin level).

Next, when the on/off control signal changes from a high level to a lowlevel, the node N1 changes to a high level, the level of the node N5changes to a low level. Since the node N5 is at a low level, the node N6which is an output of the 2-input NAND circuit NAND2 changes to high andthe high-side P-channel power MOS transistor PT1 changes to off.

At this point, in the same manner as in the first embodiment, sincecharges accumulated in the signal level detection section of the secondoff detection circuit 2 f are promptly discharged, the fall time of thegate of the P-channel power MOS transistor PT1 may be reduced, therebyenabling changes of the P-channel power MOS transistor PT1 from an onstate to an off state to be detected in less time.

Since the P-channel power MOS transistor PT1 changes to off, the levelof the node N13 changes to high and the level of the node N14 changes tohigh. Since the node N14 is at a high level and the node N1 is at a highlevel, the level of the node N2 which is an output of the 2-input NANDcircuit NAND1 changes to low and the level of the node N3 changes tohigh, and thus the low-side N-channel power MOS transistor NT2 a changesto on.

When the P-channel power MOS transistor PT1 changes to off, the node Lxchanges to a low level (Vss 0 V level).

As described above, the semiconductor device according to the presentembodiment is provided with: a first off detection circuit 2 e,positioned between the control circuit power source Vdd and thelow-potential side power source Vss and provided between the inverter 2and the gate of the N-channel power MOS transistor NT2, and the inverter7, and functions to detect signal levels of the gate of the low-sideN-channel power MOS transistor NT2; and a second off detection circuit 2f, positioned between the input power source (input voltage) Vin and thelow-potential side power source Vss and provided between the buffercircuit Buff1 and the gate of the P-channel power MOS transistor PT1,and the third level shift circuit LS3, and functions to detect signallevels of the gate of the high-side P-channel power MOS transistor PT1.

Therefore, in the same manner as in the first embodiment, the fall timetoff (NT2 a) of the gate of the low-side N-channel power MOS transistorNT2 a may be reduced. On the other hand, the fall time toff (PT1) of thegate of the high-side P-channel power MOS transistor PT1 may be reduced.

Thus, reduction in the dead time as well as the on-resistances of thepower MOS transistors may be achieved, thereby enabling improvement ofthe conversion efficiency of the stepdown-type DC-DC converter.

Fourth Embodiment

Next, a semiconductor device according to a fourth embodiment of thepresent invention will be described with reference to the drawings. FIG.8 is a circuit diagram showing a stepdown-type DC-DC converter as asemiconductor device. The stepdown-type DC-DC converter of the presentembodiment is the stepdown-type DC-DC converter of the first embodimentto which two level shift circuits have been added.

As shown in FIG. 8, the stepdown-type DC-DC converter 1 b is providedwith a first off detection circuit 2 a, a second off detection circuit 2b, a capacitor C1, a capacitor C2, a diode D1, inverters INV1 to INV4,an inverter INV6, an inverter INV7, an inductor L1, a first level shiftcircuit LS1, a second level shift circuit LS2, a third level shiftcircuit LS3, a fourth level shift circuit LS4, a fifth level shiftcircuit LS5, a 2-input NAND circuit NAND1, a 2-input NAND circuit NAND2,an N-channel power MOS transistor NT1 and an N-channel power MOStransistor NT2.

The fourth level shift circuit LS4 is provided between the inverterINV2, and the gate of the N-channel power MOS transistor NT2 and thefirst off detection circuit 2 a, and raises the signal level of the highlevel signal of node N3 outputted from the inverter INV2 by a voltageV1, and outputs to the gate of the N-channel power MOS transistor NT2and the second off detection circuit 2 b as Vdd+V1.

The fifth level shift circuit LS5 is provided between the inverter INV4,and the gate of the N-channel power MOS transistor NT1 and the secondoff detection circuit 2 b, and raises the signal level of the high levelsignal of node N7 outputted from the inverter INV4 by a voltage V1, andoutputs to the gate of the N-channel power MOS transistor NT1 and thesecond off detection circuit 2 b as Vin+Vdd+V1.

Next, operations of the stepdown-type DC-DC converter will be describedwith reference to FIG. 9. FIG. 9 is a timing chart showing an operationof the stepdown-type DC-DC converter. In the following description,portions similar to the timing chart (FIG. 4) showing an operation ofthe stepdown-type DC-DC converter according to the first embodiment willbe omitted.

As shown in FIG. 9, with the stepdown-type DC-DC converter 1 b, when theon/off control signal is at a low level, the node N1 is at a high level,and the node N5 is at a low level. Since the node N5 is at a low level,the node N6 which is an output of the 2-input NAND circuit NAND2 changesto high, the level of the node N7 changes to low, the level of the nodeN32 changes to low (Vss 0 V level), and thus the high-side N-channelpower MOS transistor NT1 changes to off.

Since the N-channel power MOS transistor NT1 changes to off, the levelof the node N13 changes to low, the level of the node N14 changes to lowand the level of the node N15 changes to high. Since the node N1 is at ahigh level and the node 15 is at a high level, the level of the node N2which is an output of the 2-input NAND circuit NAND1 changes to low, thelevel of the node N3 changes to high and the level of the node N31changes to high (Vdd+V1 level), and thus the low-side N-channel powerMOS transistor NT2 changes to on. The signal level of the low-sideN-channel power MOS transistor NT2 is higher than that of the firstembodiment by V1. Since the N-channel power MOS transistor NT1 ischanged to on, the level of the node N11 changes to high, the level ofthe node N16 changes to low and the level of the node N12 changes tolow. Therefore, the signals of the node N6 outputted from the 2-inputNAND circuit NAND2 are maintained at a high level.

Next, when the on/off control signal changes from a low level to a highlevel, since the node N1 is at a low level, the level of the node N2which is an output of the 2-input NAND circuit NAND1 changes to high,the level of the node N3 changes to low, and the level of the node N31changes to low (Vss 0 V level). Thus, the low-side N-channel power MOStransistor NT2 changes to off.

In this case, since the N-channel MOS transistor N14 which has a largedrain-source breakdown voltage (Vds) is provided in the first offdetection circuit 2 a, the voltage applied to the gate of the N-channelpower MOS transistor NT2 may be increased to Vdd+V1, which is greaterthan that of the first embodiment, and the on-resistance of theN-channel power MOS transistor NT2 may be reduced in comparison to thefirst embodiment.

When the N-channel power MOS transistor NT2 changes to off, the node N11changes to a low level, the node N16 changes to a high level, and thenode N12 changes to a high level. Since the node N12 is at a high leveland the node N5 is at a high level, the level of the node N6 which is anoutput of the 2-input NAND circuit NAND2 changes to low and the level ofthe node N7 changes to high (Vin+Vdd+V1 level), the high-side N-channelpower MOS transistor NT1 changes to on.

When the N-channel power MOS transistor NT1 changes to on, the level ofthe node Lx changes to high (Vin level), and the voltage of the BSTterminal 3 is raised to Vin+Vdd.

Next, when the on/off control signal changes from a high level to a lowlevel, the node N1 changes to a high level, and the level of the node N5changes to a low level. Since the node N5 is at a low level, the node N6which is an output of the 2-input NAND circuit NAND2 changes to high,the level of the node N7 changes to low and the level of the node N32changes to low (Vss 0 V level), and thus the high-side N-channel powerMOS transistor NT1 changes to off.

In this case, since the N-channel MOS transistor N14 which has a largedrain-source breakdown voltage (Vds) is provided in the second offdetection circuit 2 b, the voltage applied to the gate of the N-channelpower MOS transistor NT1 may be increased to Vin+Vdd+V1, which isgreater than that of the first embodiment, and the on-resistance of theN-channel power MOS transistor NT1 may be reduced in comparison to thefirst embodiment.

Since the N-channel power MOS transistor NT1 changes to off, the levelof the node N13 changes to low, the level of the node N14 changes to lowand the level of the node N15 changes to high. Since the node 15 is at ahigh level and the node N1 is at a high level, the level of the node N2which is an output of the 2-input NAND circuit NAND1 changes to low, thelevel of the node N3 changes to high and the level of the node N31changes to high (Vdd+V1 level), and thus the low-side N-channel powerMOS transistor NT2 changes to on.

When the N-channel power MOS transistor NT1 changes to off, the level ofthe node Lx changes to low (Vss 0 V level), and the voltage of the BSTterminal 3 is maintained at Vin+Vdd.

As described above, the semiconductor device according to the presentembodiment is provided with: a first off detection circuit 2 a,positioned between the control circuit power source Vdd and thelow-potential side power source Vss and provided between the inverter 2and the gate of the N-channel power MOS transistor NT2, and the inverter7, where the first off detection circuit 2 a is composed of the constantcurrent source 4, the inverter INV5, N-channel MOS transistors NT11 toNT14 and the P-channel MOS transistor PT11, and functions to detectsignal levels of the gate of the low-side N-channel power MOS transistorNT2; and a second off detection circuit 2 b, positioned between the BSTterminal 3 and the node Lx and provided between the inverter 4 and thegate of the N-channel power MOS transistor NT1, and the third levelshift circuit LS3, where the second off detection circuit 2 b iscomposed of the constant current source 4, the inverter INV5, N-channelMOS transistors NT11 to NT14 and the P-channel MOS transistor PT11, andfunctions to detect signal levels of the gate of the high-side N-channelpower MOS transistor NT1. The constant current source 4 functions topromptly change the potential of the gate of the N-channel power MOStransistors from a high level to a low level. In addition, the signallevel during an on state of the low-side N-channel power MOS transistorNT2 changes to Vdd+V1, and the signal level during an on state of thehigh-side N-channel power MOS transistor NT1 changes to Vin+Vdd+V1.

Therefore, when the low-side N-channel power MOS transistor NT2 changesfrom on to off, since charges accumulated in the signal level detectionsection of the first off detection circuit 2 a are promptly dischargedvia the constant current source 4 and the N-channel MOS transistor NT14of the first off detection circuit 2 a which functions as a diode duringits on state, the fall time toff (NT2) of the gate of the N-channelpower MOS transistor NT2 may be reduced, thereby enabling the low-sideN-channel power MOS transistor NT2 to fall rapidly. On the other hand,when the high-side N-channel power MOS transistor NT1 changes from on tooff, since charges accumulated in the signal level detection section ofthe second off detection circuit 2 b are promptly discharged via theconstant current source 4 and the N-channel MOS transistor NT14 of thesecond off detection circuit 2 b which functions as a diode in its onstate, the fall time toff (NT1) of the gate of the N-channel power MOStransistor NT1 may be reduced, thereby enabling the high-side N-channelpower MOS transistor NT1 to fall rapidly. In addition, since level shiftcircuits LS4 and LS5 are provided, the voltage applied to the gates ofthe N-channel power MOS transistors NT1 and NT2 may be increased ascompared to the first embodiment, and the on-resistances of theN-channel power MOS transistors NT1 and NT2 may be reduced in comparisonto the first embodiment.

Therefore, reduction in the dead time as well as the on-resistances ofthe N-channel power MOS transistors may be achieved, thereby enablingimprovement of the conversion efficiency of the stepdown-type DC-DCconverter in comparison to the first embodiment.

The present invention is not limited to the above-described embodiments,and various modifications may be made without departing from the spiritof the invention.

For instance, while the present invention has been applied to astepdown-type DC-DC converter in the above embodiments, the presentinvention may also be applied to step-up-type DC-DC converters andregulators. In addition, while N-channel power MOS transistors have beenapplied as the high-side and low-side switching elements in the firstand second embodiments, P-channel power MOS transistors mayalternatively be used as the high-side and low-side switching elements.

Conceivable configurations of the present invention include thosedescribed in the addenda below.

(Addendum 1)

A semiconductor device, which includes: a high-side first N-channelpower MOS transistor with a drain thereof connected to an input powersource, which is on/off operated by signals inputted to a gate thereof;a low-side second N-channel power MOS transistor with a drain thereofconnected to a source of the first N-channel power MOS transistor and asource thereof connected to a low-potential side power source, which ison/off operated by signals inputted to a gate thereof; a first offdetection circuit, having a first N-channel MOS transistor with a drainthereof connected to the gate of the first N-channel power MOStransistor, which is switched on by a first voltage applied to a gatethereof, a first constant current source, provided between a source ofthe first N-channel MOS transistor and the low-potential side powersource, which generates a constant current, and a first signal leveldetection section which detects a signal level of the gate of the firstN-channel power MOS transistor, where the first N-channel MOS transistorand the first constant current source discharge charges accumulated inthe first signal level detection section when the first N-channel powerMOS transistor switches from the on state to the off state; and a secondoff detection circuit, having a second N-channel MOS transistor with adrain thereof connected to the gate of the second N-channel power MOStransistor, which is switched on by a second voltage applied to a gatethereof, a second constant current source with one end thereof connectedto a source of the second N-channel MOS transistor, which generates aconstant current, and a second signal level detection section whichdetects a signal level of the gate of the second N-channel power MOStransistor, where the second N-channel MOS transistor and the secondconstant current source discharge charges accumulated in the secondsignal level detection section when the second N-channel power MOStransistor switches from the on state to the off state; wherein thevoltage during an on state applied to the gate of the second N-channelpower MOS transistor is higher than the first voltage applied to thegate of the first N-channel MOS transistor.

(Addendum 2)

A semiconductor device, which includes: a high-side P-channel power MOStransistor with a source thereof connected to an input power source,which is on/off operated by signals inputted to a gate thereof; alow-side N-channel power MOS transistor with a drain thereof connectedto a drain of the P-channel power MOS transistor and a source thereofconnected to a low-potential side power source, which is on/off operatedby signals inputted to a gate thereof; a first off detection circuit,having a first N-channel MOS transistor with a drain thereof connectedto the gate of the first N-channel power MOS transistor, which isswitched on by a first voltage applied to a gate thereof, a firstconstant current source, provided between a source of the firstN-channel MOS transistor and the low-potential side power source, whichgenerates a constant current, and a first signal level detection sectionwhich detects a signal level of the gate of the N-channel power MOStransistor, where the first N-channel MOS transistor and the firstconstant current source discharge charges accumulated in the firstsignal level detection section when the N-channel power MOS transistorswitches from the on state to the off state; and a second off detectioncircuit, having a second N-channel MOS transistor with a drain thereofconnected to the gate of the P-channel power MOS transistor, which isswitched on by a second voltage applied to a gate thereof, a secondconstant current source with one end thereof connected to a source ofthe second N-channel MOS transistor, which generates a constant current,and a second signal level detection section which detects a signal levelof the gate of the P-channel power MOS transistor, where the secondN-channel MOS transistor and the second constant current sourcedischarge charges accumulated in the second signal level detectionsection when the P-channel power MOS transistor switches from the onstate to the off state; wherein the voltage during an on state appliedto the gate of the N-channel power MOS transistor is higher than thefirst voltage applied to the gate of the first N-channel MOS transistor.

1. A semiconductor device configured to complementarily control on/offof a high-side switching element provided on a high voltage side powersource side, which switches on/off according to a signal inputted to acontrol electrode, and a low-side switching element provided on a lowvoltage side power source side, which switches on/off according to asignal inputted to a control electrode, the high-side switching elementand the low-side switching element being connected between a high-sidereference voltage and a low-side reference voltage, comprising: an offdetection circuit having a constant current source which generates aconstant current, a first transistor with a first electrode to beconnected to the control electrode of the low-side switching element anda second electrode connected to the constant current source, which isswitched on by a predetermined voltage applied to a control electrode,and a signal level detection section which detects a signal level of thecontrol electrode of the low-side switching element, where the constantcurrent source and the first transistor discharge charges accumulated inthe signal level detection section when the low-side switching elementswitches from the on state to the off state.
 2. The semiconductor deviceof claim 1, wherein the first transistor is a first N-channel MOStransistor.
 3. The semiconductor device of claim 2, wherein the firsttransistor has a drain-source breakdown voltage that is higher thanthose of transistors, other than the first transistor, which configurethe off detection circuit.
 4. The semiconductor device of claim 1,wherein the off detection circuit comprises a second transistor, havinga first electrode connected to the second electrode of the firsttransistor, which is switched on by an input signal inputted to acontrol electrode when the low-side switching element switches from theon state to the off state, and the constant current source and the firstand second transistors discharge charges accumulated in the signal leveldetection section when the low-side switching element switches from theon state to the off state.
 5. The semiconductor device of claim 4,wherein the first and second transistors are N-channel MOS transistorsrespectively.
 6. The semiconductor device of claim 5, wherein the firsttransistor has a drain-source breakdown voltage that is higher thanthose of transistors, other than the first transistor, which configurethe off detection circuit.
 7. The semiconductor device of claim 1,further comprising a level shift circuit connected to the controlelectrode of the low-side switching element, which raises the signalinputted to the control electrode of the low-side switching element andoutputs the raised signal to the control electrode of the low-sideswitching element and the off detection circuit.
 8. A semiconductordevice configured to complementarily control on/off of a high-sideswitching element provided on a high voltage side power source side,which switches on/off according to a signal inputted to a controlelectrode and a low-side switching element provided on a low voltageside power source side, which switches on/off according to a signalinputted to a control electrode, the high-side switching element and thelow-side switching element being connected between a high-side referencevoltage and a low-side reference voltage, comprising: an off detectioncircuit having a first constant current source which generates aconstant current, a first transistor with a first electrode to beconnected to the control electrode of the high-side switching elementand a second electrode connected to the first constant current source,which is switched on by a predetermined voltage applied to a controlelectrode, and a signal level detection section which detects a signallevel of the control electrode of the high-side switching element, wherethe first constant current source and the first transistor dischargecharges accumulated in the signal level detection section when thehigh-side switching element switches from the on state to the off state.9. The semiconductor device of claim 8, wherein the first transistor isa N-channel MOS transistor.
 10. The semiconductor device of claim 9,wherein the first transistor has a drain-source breakdown voltage thatis higher than those of transistors, other than the first transistor,which configure the off detection circuit.
 11. The semiconductor deviceof claim 8, wherein the off detection circuit comprises a secondtransistor, having a first electrode connected to the second electrodeof the first transistor, which is switched on by an input signalinputted to a control electrode when the high-side switching elementswitches from the on state to the off state, and the first constantcurrent source and the second and second transistors discharge chargesaccumulated in the signal level detection section when the high-sideswitching element switches from the on state to the off state.
 12. Thesemiconductor device of claim 11, wherein the second and secondtransistors are N-channel MOS transistors respectively.
 13. Thesemiconductor device of claim 12, wherein the first transistor has adrain-source breakdown voltage that is higher than those of transistors,other than the first transistor, which configure the off detectioncircuit.
 14. The semiconductor device of claim 8, further comprising alevel shift circuit connected to the control electrode of the high-sideswitching element, which raises the signal inputted to the controlelectrode of the high-side switching element and outputs the raisedsignal to the control electrode of the high-side switching element andthe off detection circuit.
 15. The semiconductor device of claim 7,wherein the first transistor has a drain-source breakdown voltage thatis higher than those of transistors, other than the first transistor,which configure the off detection circuit.
 16. The semiconductor deviceof claim 7, wherein the off detection circuit comprises a thirdtransistor, having a first electrode connected to the second electrodeof the first transistor, which is switched on by an input signalinputted to the control electrode when the low-side switching elementswitches from the on state to the off state, and the constant currentsource and the first and third transistors discharge charges accumulatedin the signal level detection section when the low-side switchingelement switches from the on state to the off state.
 17. Thesemiconductor device of claim 14, wherein the first transistor has adrain-source breakdown voltage that is higher than those of transistors,other than the first transistor, which configure the off detectioncircuit.
 18. The semiconductor device of claim 14, wherein the offdetection circuit comprises a second transistor, having a firstelectrode connected to the second electrode of the first transistor,which is switched on by an input signal inputted to the controlelectrode when the high-side switching element switches from the onstate to the off state, and the first constant current source and thesecond and second transistors discharge charges accumulated in thesignal level detection section when the high-side switching elementswitches from the on state to the off state.
 19. A semiconductor deviceconfigured to complementarily control on/off of a high-side switchingelement provided on a high voltage side power source side, whichswitches on/off according to a signal inputted to a control electrodeand a low-side switching element provided on a low voltage side powersource side, which switches on/off according to a signal inputted to acontrol electrode, the high-side switching element and the low-sideswitching element being connected between a high-side reference voltageand a low-side reference voltage, comprising: a first off detectioncircuit having a first constant current source which generates aconstant current, a first transistor with a first electrode to beconnected to a control electrode of the low-side switching element and asecond electrode connected to the first constant current source, whichis switched on by a first voltage applied to the control electrode, anda first signal level detection section which detects a signal level ofthe control electrode of the low-side switching element, where the firstconstant current source and the first transistor discharge chargesaccumulated in the first signal level detection section when thelow-side switching element switches from the on state to the off state;and a second off detection circuit having a second constant currentsource which generates a constant current, a second transistor with afirst electrode to be connected to a control electrode of the high-sideswitching element and a second electrode connected to the secondconstant current source, which is switched on by a second voltageapplied to the control electrode, and a second signal level detectionsection which detects a signal level of the control electrode of thehigh-side switching element, where the second constant current sourceand the second transistor discharge charges accumulated in the secondsignal level detection section when the high-side switching elementswitches from the on state to the off state.
 20. The semiconductordevice according to claim 19, further comprising the high-side switchingelement and the low-side switching element.